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Surface Curing Silicone Compound

Momentive's Surface Curing Silicone Compounds cure upon exposure to atmospheric moisture to form a cured exterior surface while maintaining a pasty consistency on the interior. Its performance is similar to a grease, however it is characterized by extremely low bleed and volatile contents. These non-adhesive compounds contribute to process ease and repairability in a broad array of thermal applications.

Momentive's Curable Thermally Conductive Silicone Compounds cure upon exposure to atmospheric moisture to form a cured exterior surface, while maintaining a pasty consistency in the interior. These materials provide the combined benefit of low thermal resistance and repairability of thermal greases, and the low bleed and volatile contents of curable thermal materials, and help contribute to the stability of the thermal interface under harsh operating conditions.

Key Features

  • High thermal conductivity
  • Low bleed and volatile content
  • Non-adhesive, repairable
  • Thixotropic, low viscosity. Conductive to syringe dispensing.

Products variance:

TIS380C; TIS480C-L

 

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