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> LOCTITE 3611™


LOCTITE 3611™ is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines. The very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.

LOCTITE 3611™ provides the following product characteristics: