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LOCTITE 3629

LOCTITE 3629 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required. LOCTITE 3629 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.

LOCTITE 3629 provides the following product characteristics: